来源：NTU

Overview of Programme

The MSc (Electronics) programme is offered on a part-time and full-time basis for engineers in the electronics industry who would like to have graduate training in various topics, amongst others, in integrated circuit design, microelectronics fabrication and manufacture of electronic and photonic products.

Curriculum structure

The lectures are conducted in the evenings. The degree requires satisfactory completion of a total of 30 AUs. This may be fulfilled in two different ways:

1. Four core and four elective courses with 3 AUs each and a dissertation of 6 AUs. The project for the dissertation may be undertaken either in NTU or in the industry.
2. Four core and five elective courses with 3 AUs each and an Independent Study Module (ISM) of 3 AUs.

Part-time candidates typically register for two courses per semester, while full-time candidates register for four courses.

Core Courses

• EE6306 Digital IC Design
• EE6601 Advanced Wafer Processing
• EE6602 Quality and Reliability Engineering
• EE6604 Advanced Topics in Semiconductor Devices

Elective Courses (select any 4 or 5 courses)

• EE6307 Analog IC Design
• EE6303 Electromagnetic Compatibility and Interference
• EE6328 Signal Integrity in High-Speed Digital Systems
• EE6608 Advanced Semiconductor Physics
• EE6610 IC Packaging
• EE6617 Nanoelectronics
• EE6802 Laser Technology and Applications
• EE6801 Modern Optics
• EE6808 Display Technologies
• EE6401 Advanced Digital Signal Processing
• EE6203 Computer Control Systems
• EE6506 Power Semiconductor & Passive Devices
• ES6102 Advanced Digital system design
• ES6103 Embedded System Programming

CONTENT OF SUBJECTS 部分课程

EE6306
DIGITAL IC DESIGN
Review of Integrated Circuit Fundamentals. Layout and Design Issues. CMOS Digital Circuits. BiCMOS Digital Circuits. Sub-System Design in Digital Circuits. Design Methodologies.

EE6307
ANALOG IC DESIGN
Review of Fundamentals. Analog Building Blocks. Switched Capacitor Circuits. Current Mode Circuits. Continuous-Time Filters. Data Converters and Mixed Signal Techniques.

EE6308
RF IC DESIGN
System Design Considerations. CMOS RF Components and Devices. Low-noise amplifier (LNA); Mixers; Voltage-controlled oscillators (VCOs). RF power amplifiers. Phase-Locked Loops and Frequency Synthesizers.

EE6328
SIGNAL INTEGRITY IN HIGH-SPEED DIGITAL SYSTEMS
High speed properties of logic gates. Modeling and analysis of interconnections. Transmission lines and terminations. Power distribution networks and ground planes. Clock distribution. Case study.

EE6601
ADVANCED WAFER PROCESSING
Thin film deposition. Chemical and mechanical polishing. Lithography and resist technology. Etching process and technology. Cleaning technology. Process integration. Metrology and analytical techniques.

EE6602
QUALITY & RELIABILITY ENGINEERING
Quality management and planning. Statistical process control. Design of experiments. Reliability planning & statistical framework. Burn-in, FMEA and accelerated testing.

EE6604
ADVANCED TOPICS IN SEMICONDUCTOR DEVICES
Bipolar transistor operating principles. Bipolar device modelling. State-of-the-art bipolar structures. MOS device operation. MOSFET modelling. MOS device scaling effects. Semiconductor memories. Semiconductor heterojunctions. Future trends and challenges.

EE6605
SUB-MICRON SEMICONDUCTOR PROCESS & DEVICE SIMULATION
The subject will cover the design and simulation for sub-micron integrated circuits and their fabrication. There will be virtual wafer fabrication, virtual device characterization and virtual process integration modules. The students will be required to carry out the design with hands-on project exercises through the use of simulation software packages.

EE6606
FAILURE MECHANISMS IN SEMICONDUCTOR DEVICES
Introduction to Failure Mechanisms. Bulk failure mechanism of semiconductor devices. Dielectric failure mechanisms of semiconductor devices. Metalization failure mechanisms of semiconductor devices. Interface failure mechanisms of semiconductor devices. Reliability testing.

EE6608
ADVANCED SEMICONDUCTOR PHYSICS
Crystal structure. Energy bands of semiconductors. Doping and carrier concentrations. Electrical transport phenomena. High field effects. Optical and thermal properties. Quantum size effects.

EE6609
HIGH-SPEED SEMICONDUCTOR DEVICES
Fundamentals of heterojunction devices. Material growth and device processing techniques. Advanced field effect transistors. Heterojunction bipolar transistors. Hot-electron and quantum-effect devices. Characterization and measurement techniques.

EE6610
INTEGRATED CIRCUIT PACKAGING
Plastic packaging materials. Manufacturing processes for plastic encapsulated microelectronics. State-of-the-art packaging techniques. Failure mechanisms, sites and modes. Qualification process and accelerated testing. Effects of packaging on the electrical performance. Future trends and challenges.

EE6614
SENSORS & ACTUATORS
Introduction. Dielectric Phenomena and Models. Semiconducting Phenomena in Electronic Ceramics and Sensors. Piezoelectric, Electrostriction and Pyroelectric Sensors and Actuators. Optical Phenomena and Applications. Magnetic Phenomena and Applications. Sensor and Actuator Systems.

EE6615
Microelectromechanical Systems (MEMS) Technology
Overview. MEMS Fabrication Technology. MEMS Design, Simulation and Layout. Electronic Interfaces, Packaging and Testing. MEMS Devices and Applications.

EE6616
CMOS Wafer Fabrication and Device Characterization
Hands-on experience in the clean room to fabricate CMOS transistors, MOS capacitors and other devices starting from bare silicon wafers. Electrical measurements and device characterization of CMOS devices. Clean Room Design and Protocol. Laboratory Safety. Wafer Cleaning. Thermal Oxidation and Thermal Diffusion. Photolithography. Wet Etching and Plasma Dry Etching. Ion Implantation. Thin Film Deposition. Metallization. Process Integration. Metrology. SEM, Microscopes, Use of semiconductor parameter analyzer, Electrical Measurements and Device Characterization.

EE6617
Nanoelectronics
Introduction to Nanotechnology. Synthesis of Nanomaterials. Lithography. Analysis and Manipulation Methods. Carbon Nanotubes and its applications. Quantum Computing.

EE6803
Optical Electronic Devices
Dielectric Photonic Materials. Integrated Optics. Light Modulation and Switching. Optical Detection. Device for Optical Communications.

EE6807
Compound Semiconductor Epitaxial GrowthTechnology
Epitaxy Technology and Growth Mechanisms. Liquid Phase Epitaxy (LPE). Metallorganic Chemical Vapour Deposition (MOCVD). Molecular Beam Epitaxy (MBE). Material Characterization. Semiconductor Microstructures and Applications.

EE6808
Display Technologies
Electronic Information Displays. Passive Matrix Liquid Crystal Displays. Active Matrix Liquid Crystal Displays. Plasma Display Panels. Organic Light-Emitting Devices. Field Emission Displays. Electroluminescent Displays and Electrochromic Displays. Emerging Display Technologies.